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Copper Anode for Plating
| Various anodes are offered for copper plating material. The stable quality with homogeneous crystal structure can be provided by cold forging for copper balls and rolling for plates and ovals. Our material provides stable performance with little sludge generation. |
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| ฃCopper Anode for Plating |
Example of Use
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| ฃPrinted Circuit Board |
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| ฃPersonal Computer |
Types(%j
| Types |
Cu |
P |
| Phosphorus-containing copper |
99.9
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0.040`0.06 |
| Oxygen-free copper |
99.96
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Shape and dimensionsim/m)
| Shape |
Dimensions |
| Ball |
27ำ,42ำ,45ำ,50ำ,55ำ |
| Plate |
13t~25W~50L,13t~150W~L |
| Oval |
33~75~L |
| Consult our expert staff for sheet and oval lengths. |
| Features: |
The crystal grains are small and uniform because copper anodes are produced by cold forging or rolling. Consequently, uniform electrodeposition can be obtained during plating, and since only a little sludge is generated, the life of plating solution can be extended, and remarkably easy solution control will result, including markedly reduced solution replacement frequency,etc. |
Manufacturing process
Copper round rods จ cutting จ cold forging จ acid - cleaning
and degreasing machine จ automatic weighing and packaging
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Copyright(C) 2008 Gonda Metal Industry Co., Ltd. All Rights Reserved. |
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Company Profile and History
